Roberto Gaddi

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In this paper we present our efforts in characterizing and optimizing the influence of a Wafer-Level Packaging (WLP) solution on the electromagnetic behaviour of RF-MEMS devices. To this purpose, a fully parameterized FEM model of a packaged Coplanar Waveguide (CPW) is presented in order to optimize all the technology degrees of freedom (DoF's) made(More)
In this work, a new method is presented for the extraction of low order electromechanical models for dynamic nonlinear simulation of radio frequency (RF) microelectromechanical (MEMS) switches, using model order reduction (MOR). The method is based on a separate modeling of the electrical and the mechanical part of the problem, which are coupled at circuit(More)
—A reduced order model for the small signal analysis of micromechanical structures (MEMS) has been extracted by applying model order reduction (MOR) to their finite element models. The low-order model conserves the accuracy belonging to the finite element method, while drastically reducing the computational time. Moreover, it gives a description of the(More)
This paper deals with the design and experimental validation of a tunable matching network for discrete-resizing CMOS power amplifiers operating at 2.45 GHz (i.e. in the WiFi frequency band). The network is based on a two stages ladder configuration and exploits high-Q MEMS capacitors to achieve the impedance tuning. Furthermore , since these capacitors can(More)
We propose the design of a reconfigurable impedance matching network for the lower RF frequency band, based on a developed RF-MEMS technology. The circuit is composed of RF-MEMS ohmic relays, metal-insulator-metal (MIM) capacitors and suspended spiral inductors, all integrated on a high resistivity Silicon substrate. The presented circuit is well-suited for(More)
A simulation methodology to reduce computational time of pre-stressed harmonic analysis of radio frequency (RF) microresonators is demonstrated. The methodology is based on the application of model order reduction to a system of ordinary differential equations obtained after spatial discretization by finite element software. Model order reduction produces a(More)
In RF-MEMS packaging, next to the protection of movable structures, optimization of package electrical performance plays a very important role. In this work, a wafer-level packaging process has been investigated and optimized in order to minimize electrical parasitic effects. The package concept used is based on a wafer-level bonding of a capping silicon(More)
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