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Journals and Conferences
Through an aggressive product development program which includes experiment and simulation, Amkor has developed the next level of WLCSP (CSP<sup>nl™</sup>), a product which exhibits superior board level reliability when subjected to drop impact, a strong requirement for portable electronics. Failure mechanism of WLCSP under drop test has been… (More)
The Wafer Level Chip Scale Package (WLCSP) is gaining popularity for its performance and for its ability to meet miniaturization requirements of certain electronic products, especially handheld devices like cell phones. Due to differential bending between the silicon die and the PCB and the large stiffness difference, board level drop/bend tests are widely… (More)
The SEL, SEGR, SEB and TID test results are presented for the Cobham CAN FD Transceiver. The device is SEL, SEGR, and SEB immune to a LET &#8804; 100 MeV&#183;cm2/mg and TID qualified to 100krad(Si).
The SEL and TID test results are presented for the Cobham radiation hardened bus switch family of products. The device is SEL immune to an effective LET &#8804; 100 MeV&#183;cm2/mg and TID qualified to 300krad(Si).