Rene Kregting

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Copper based wire bonding technology is widely accepted by electronic packaging industry due to the world-wide cost reduction actions (compared to gold wire bond). However, the mechanical characterization of copper wire differs from the gold wire; hence the new wire bond process setting and new bond pad structure is required. It also refers to the new(More)
In a RF power application such as the OMP, the wires are subjected to high current (because of the high power) and high temperature (because of the heat from IC and joule-heating from the wire itself). Moreover, the wire shape is essential to the RF performance. Hence, the aluminium wire is preferred and wedge-wedge wire bonding is widely used. As a result(More)
Life time predictions of microelectronics products are based on accelerated tests (ALT) [1]. The statistical distribution of failures, as typically shown in a Weibull plot, arise from the random variables such as material properties and geometric tolerances in manufacturing. These variations give rise to uncertainty in product life [2]. During the project,(More)
Intrinsic stresses in bondpads may lead to early failure of IC’s. In order to determine the intrinsic stresses in semiconductor structures, a new procedure is set up. This procedure is a combined experimental/ numerical approach which consists of the following steps: First, a conductive gold layer (20 nm thickness) is deposited on the power line surface;(More)
The introduction of new materials or technologies can have an enormous impact on the Time to Market (TTM) of new products. Preferably, the performance of new materials or technologies is known before these are designed into a product. This paper presents a reliability assessment approach which has been developed with the aim to reduce the so called Time to(More)
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