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Earlier, deeper investigations into the drift behavior of thin-film resistors have shown that the usual methods for predicting drift are incapable of describing the present remarkable differences within a certain R-layer alloy system (for example, CrNi) or those between different alloy systems (for example, CrNi versus CrSi or TaN). In order to come to a… (More)
A very common method to predict the reliability of components soldered on printed circuit board (PCB) or substrates is by bending tests and temperature cycle tests, for instance between-55 °C and 125 °C (up to 2000 cycles at 1 h cycle period). Sensitive SMD constructions such as chips with ball grid array mounting or multilayer chip capacitors (MLCC) are… (More)