Raymond A. Adomaitis

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This paper discusses the development of a set of object-oriented modular simulation tools for solving lumped and spatially distributed models generated from chemical process design and simulation problems. Developed in the context of simulating semiconductor manufacture equipment, this framework reduces the software development cycle time associated with(More)
A n umerical solution procedure combining several weighted residual methods and based on global trial function expansion is developed to solve a model for the steady state gas ow eld and temperature distribution in a low-pressure chemical vapor deposition reactor. The enthalpy ux across waferrgas boundary is calculated explicitly and is found to vary(More)
applies and teaches advanced methodologies of design and analysis to solve complex, hierarchical, heterogeneous and dynamic problems of engineering technology and systems for industry and government. Abstract A framework is presented for step-by-step implementation of weighted-residual methods (MWR) for simulations that require the solution of(More)
Experimental measurements of wafer temperature in a single-wafer, lamp-heated chemical vapor deposition system were used to study the wafer temperature response to gas composition. A physically based simulation procedure for the process gas and wafer temperature was developed in which a subset of parameter values were estimated using a nonlinear, iterative(More)
In this paper, we report on numerical solutions and model reduction results for a plasma glow discharge model with a radio frequency ionization source. A pseu-dospectral implementation of a global spectral method was found to give accurate simulation results that correctly reflected the expected physical behavior of an argon plasma under the simulated(More)
—A reduced-order model describing a rapid thermal chemical vapor deposition (RTCVD) process is utilized for real-time model based control for temperature uniformity across the wafer. Feedback is based on temperature measurements at selected points on the wafer surface. The feedback controller is designed using the internal model control (IMC) structure,(More)
applies and teaches advanced methodologies of design and analysis to solve complex, hierarchical, heterogeneous and dynamic problems of engineering technology and systems for industry and government. Abstract: A model of a tungsten chemical vapor deposition (CVD) system is developed to study the CVD system thermal dynamics and wafer temperature(More)
A global discretization approach w as taken to solve a self-consistent DC glow discharge model to study the interplay b e t ween modeling assumptions and convergence of the numerical solution techniques. It was found that the assumed form of electron diiusivity temperature dependence had a profound innuence on the computed solutions. The numerical(More)