Raj Jammy

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Well designed tunneling green transistor may enable future VLSIs operating at 0.1V. Sub-60mV/decade characteristics have been convincingly demonstrated on 8 " wafers. Large I ON at low V DD are possible according to TCAD simulations but awaits verification. V DD scaling will greatly benefit from low (effective) band gap energy, which may be provided by type(More)
We have demonstrated high mobility pMOSFETs on high quality epitaxial SiGe films selectively grown on Si (100) substrates. With a Si cap processed on SiGe channels, HfSiO<inf>2</inf> high-k gate dielectrics exhibited low C-V hysteresis (&#x226A;10 mV), interface trap density (7.5&#x00D7;10<sup>10</sup>), and gate leakage current(More)
After over 10 years of intensive study on high-k dielectric and metal gate electrode to replace silicon based materials (Si02 or SiON gate dielectric and polysilicon gate) in the complementary-metal-oxide-semiconductor (CMOS) application, it was claimed that hafnium based dielectric and metal gate are finally ready to be implemented in 45nm technology and(More)
Lower operation current and voltage are strongly required for scaled RRAM devices with high density memory cell arrays. As the lower operation current reduces the size of the conductive filament, stable high speed endurance performance of RRAM device becomes a challenging issue. In this work, for the first time, we demonstrate 1&#x03BC;A,(More)
Improved static noise margin in SRAM of 18% and decreased intrinsic inverter delay of 6% is demonstrated for the first time in double-gate CMOS finFET with gate- source/drain underlap doping. The excellent results are achieved by optimization of the spacer while simplifying the processing of source/drain region by skipping costly implants. Improved circuit(More)
We demonstrate electrical properties of rare earth (RE)-doped HfO<sub>2</sub> and ZrO<sub>2</sub> for application as higher permittivity (k) dielectrics in logic and memory devices. X-ray diffraction (XRD) results show that Dy, Er, and Gd doping stabilizes the higher-k tetragonal phase rather than the lower-k monoclinic phase. This preferred tetragonal(More)
—We demonstrate L g = 100 nm high-speed enhancement-mode (E-mode) InAs quantum-well MOSFETs with outstanding high-frequency and logic performance. These devices feature a 3-nm Al 2 O 3 layer grown by atomic layer deposition. The MOSFETs with L g = 100 nm exhibit V T = 0.2 V (E-mode), R ON = 370 Ω · μm, S = 105 mV/dec, DIBL = 100 mV/V, and g m_ max = 1720(More)
A novel high temperature silicide process using millisecond anneal is reported. Superior thermal stability, film properties (Rs, surface roughness) and low contact resistivity to n&#x002B; silicon of &#x003C; 1 &#x03A9;&#x03BC;m<sup>2</sup> is demonstrated with milli-second silicide anneal which results in grain size change and potential strain(More)
Low power and reliable &#x201C;Fab-friendly&#x201D; resistance switching memory devices (ReRAM) are achieved by controlling composition and morphology of simple binary transition-metal oxides (MeOx) and metal-nitride electrodes (Ti-N) through physical vapor deposition (PVD) methods. Adjusting PVD deposition parameters influence crystalline structure,(More)