Rainer Dohle

We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
The purpose of our study is to evaluate the feasibility of room-temperature wedge-wedge bonding using commercially available 25 µm copper wires, coated with aluminum. Bonding quality, reliability and aging resistance of the wire bonds have been investigated using standard wire pull tests immediately after bonding and after accelerated life tests, including(More)
  • 1