Rafael Estevez

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Copper direct bonding technology is considered to be one of the most promising approach for matching the miniaturization needs of future 3D integrated high performance circuits (3D-IC). In this study, we discuss the recent achievements in copper direct bonding technology with oxide/copper mixed surface and present the latest electrical and physical(More)
Among the numerous ways to process 3D stacking of integrated circuits, a promising method is the use of Cu/SiO<sub>2</sub> hybrid bonding, which enables simultaneous mechanical and electrical connections with an interconnection pitch limited only by photolithography resolution and alignment accuracy. In this work, we present a finite element model of the(More)
This work proposes a shape and topology optimization framework oriented towards conceptual architectural design. A particular emphasis is put on the possibility for the user to interfere on the optimization process by supplying information about his personal taste. More precisely, we formulate three novel constraints on the geometry of shapes; while the(More)
A level set based shape and topology optimization framework is used to study the effect of graded interfaces in the optimization process of micro-architectured multi-materials. In contrast to previous studies interfaces are considered as smooth transition between phases instead of a sharp delimitation between two phases. A study on extreme thermoelastic(More)
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