Rafael Estevez

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iii Acknowledgements I am sincerely and heartily grateful to my director Dr.Alain Combescure and my co-directors Dr.Julien Réthoré & Dr.Thomas Elguedj for their support during my PhD. This thesis would not have been possible without their guidance. This work was performed by the funding of INSA Lyon. I am also thankful to Mr.Philippe Chaudet and Mr.Paul(More)
Among the numerous ways to process 3D stacking of integrated circuits, a promising method is the use of Cu/SiO<sub>2</sub> hybrid bonding, which enables simultaneous mechanical and electrical connections with an interconnection pitch limited only by photolithography resolution and alignment accuracy. In this work, we present a finite element model of the(More)
—Copper direct bonding technology is considered to be one of the most promising approach for matching the miniaturization needs of future 3D integrated high performance circuits (3D-IC). In this study, we discuss the recent achievements in copper direct bonding technology with oxide/copper mixed surface and present the latest electrical and physical(More)
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