Rachel Gordin

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This paper expands the on-chip interconnect-aware methodology for high-speed analog and mixed signal design, presented in [4], into a wider class of designs, including dense layout CMOS design. The proposed solution employs a set of parameterized on-chip transmission line (T line) devices for the critical interconnects, which is expanded to include coplanar(More)
This paper presents an on-chip, interconnect-awaremethodology for high-speed analog and mixed signal(AMS) design which enables early incorporation of on-chiptransmission line (T-line) components into AMS design flow.The proposed solution is based on a set of parameterizedT-line structures, which include single and two coupled microstriplines with optional(More)
This paper presents a wideband modeling methodology for on-chip coplanar single and coupled transmission lines over the conductive silicon substrate. Cost effective, semi analytical models have been developed, being purely based on explicit expressions. Silicon substrate induced loss and dispersion effects are considered, as well as the skin and proximity(More)
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