R. Mahamdi

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This work deals with in situ boron diffusion and activation in multilayer films: polysilicon (Poly1)/ amorphous silicon (Poly2). These films are deposited by LPCVD technique. However, several heat treatments were carried in order to determine the optimal annealing conditions to suppress boron penetration from the gate to the substrate through the gate oxide(More)
Silicon oxynitride (SiO(X)N(Y)) thin films were deposited by plasma-enhanced chemical vapour deposition technique (PECVD) from silane (SiH4), nitrous oxide (N2O), ammonia (NH3) and nitrogen (N2) mixture. Spectroscopic ellipsometry (SE), in the range of wavelengths 450-900 nm, was used to define the film thickness and therefore the deposition rate, as well(More)
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