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Magnetic susceptibility measurements of high purity MgO single crystals (<50-wt. ppm transition metals) by means of a vibrating-sample magnetometer shows an anomaly at 800 K. At the same temperature the electric conductivity increases anomalously, the static dielectric constant epsilon increases from 9 to approximately 150, a pronounced positive surface(More)
This paper deals with the functional reliability study of a new 16 A - 600 V high-temperature TRIAC family, subjected to power cycles, simulating the component in harsh real operation conditions. The targeted application is a vacuum cleaner (1800 W - 230 V - 50 Hz). In this kind of application, one of the major issues for TRIAC, which leads to high(More)
This paper deals with the thermo-mechanical properties experimental characterization of solder alloys used in power electronics packaging, and especially for TRIAC. The lead-based solder &#x2013; Pb<inf>92.5</inf>Sn<inf>5.0</inf>Ag<inf>2.5</inf> &#x2013; is evaluated. The Young's modulus, the yield strength, the mechanical strength, and the elongation at(More)
To secure the reliability of lead free solder is a critical problem for microelectronics packaging. The drop test is used to characterize the reliability of the soldered assemblies. Numerical simulation techniques are popularly used for such tests to reduce the cost. A proper working combination of the damage criterion and the numerical simulation to(More)
In this paper, we analyze the rise time and dwell time impact on 16A&#x2013;600V high temperature Triacs reliability subjected to power cycling. Experimental tests, performed on two TO-220 packages (insulated or not), show that rise time and dwell time have a negligible contribution on Triacs lifetime. Failure analysis confirms that the physical failure(More)
0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.08.017 ⇑ Corresponding author at: STMicroelectronics, 16 7155, 37071 Tours Cedex 2, France. Tel.: +33 (0)2 47 01 34. E-mail address: sebastien.jacques@st.com (S. Jacqu In this paper, a physical model is proposed to estimate the TRIAC solder joint fatigue during power cycling. The(More)
In this paper, a physical model is proposed to estimate the TRIAC solder joints fatigue during power cycling. The lifetime prediction is based on the following assumptions: the case temperature swing (&#x0394;T<inf>case</inf>) is the main acceleration factor, the solder joints are the weakest materials in the TRIAC assembly, and the plastic strain within(More)
Reliability tests and simulated results on medium power components are discussed in this paper. This study is based on statistical data coming from thermal cycling tests (TCT, air-air test) and thermal shock tests (TST, liquid-liquid test), which are correlated with information coming from failure analysis and compared to results issued from 3D finite(More)