R.L. Keusseyan

We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
Materials and processes have been developed for brazing pin, lead, window frame, and heat sink metals to alumina and glass ceramic substrates. The substrates are metallized using copper-, silver-, palladium/silver-, or gold-based thick-film pastes that are fired in the 850 degrees C to 950 degrees C temperature range. The metal-ceramic bond strengths(More)
A new thick film multilayer material system has been developed to meet the increasingly demanding cost and performance requirements of the marketplace. The key feature of the system is a new two-print multilayer dielectric composition that survives -40/+125"C thermal cycle excursions with soldered components, and has good yield and electrical reliability at(More)
  • 1