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Chip-level power and thermal implications will continue to rule as one of the primary design constraints and performance limiters. The gap between average and peak power actually widens with increased levels of core integration. As such, if per-core control of power levels (modes) is possible, a global power manager should be able to dynamically set the(More)
Leakage power is a major concern in current and future microprocessor designs. In this paper, we explore the potential of architectural techniques to reduce leakage through power-gating of execution units. This paper first develops parameterized analytical equations that estimate the break-even point for application of power-gating techniques. The potential(More)
Ensuring long processor lifetimes by limiting failuresdue to wear-out related hard errors is a critical requirementfor all microprocessor manufacturers. We observethat continuous device scaling and increasing temperaturesare making lifetime reliability targets even harder to meet.However, current methodologies for qualifying lifetime reliabilityare overly(More)
Increased power densities (and resultant temperatures) and other effects of device scaling are predicted to cause significant lifetime reliability problems in the near future. In this paper, we study two techniques that leverage microarchitectural structural redundancy for lifetime reliability enhancement. First, in structural duplication (SD), redundant(More)
The relentless scaling of CMOS technology has provided a steady increase in processor performance for the past two decades. However, increased power densities (hence temperatures) and other scaling effects have an adverse impact on long-term processor lifetime reliability. This paper represents a first attempt at quantifying the impact of scaling on(More)
Power-related issues have become important considerations in current generation microprocessor design. One of these issues is that of elevated on-chip temperatures. This has an adverse effect on cooling cost and, if not addressed suitably, on chip reliability. In this paper we investigate the general trade-offs between temporal and spatial hot spot(More)
Soft errors are a growing concern for processor reliability. Recent work has motivated architecture-level studies of soft errors since the architecture can mask many raw errors and architectural solutions can exploit workload knowledge. This paper proposes a model and tool, called SoftArch, to enable analysis of soft errors at the architecture-level in(More)
Increasing power dissipation has become a major constraint for future performance gains in the design of microprocessors. In this paper, we present the circuit design of an issue queue for a superscalar processor that leverages transmission gate insertion to provide dynamic low-cost configurability of size and speed. A novel circuit structure dynamically(More)