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This paper characterizes of spiral inductor on silicon wafer using post-IC process. There are two critical factors to affect Quality factor of on-chip spiral inductor; one is a resistance of… (More)
As portable devices have become smaller, thinner, lighter and more powerful in the recent years, the request of chip scale packages has become extremely high. However since the packages have the… (More)
In this work, a 400-lead TFBGA with eutectic solder ball is selected as test vehicle. Both package and board level reliability tests are conducted to compare the solder joint reliability of the test… (More)
Abstract Mechanical responses of Nb–15W–0.5Si–2B– x Hf alloys ( x = 0, 5, 10 and 15 mol%) were investigated to probe the balance between room-temperature ductility and high-temperature strength… (More)