Piotr Putek

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In this paper we focus on a shape/topology optimization problem of a power MOS transistor under geometrical and material uncertainties to reduce the current density overshoot. This problem, occurring in the automotive industry, yields a stochastic electro-thermal coupled problem. Its solution enables to investigate the propagation of uncertainties through a(More)
In this paper we focus on incorporating a stochastic collocation method (SCM) into a topology optimization for a power semiconductor device with both material and geometrical uncertainties. Such geometrical and material variations, which result predominantly from lithography proximity and process imperfections, have a direct impact on its yield and(More)
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