Piotr Kocanda

  • Citations Per Year
Learn More
This paper attempts to investigate the feasibility of chip's operating frequency/supply voltage using data about cooling efficiency. It focuses in the introduction of the concept of time shift (TS). TS is the interval of time in which the chip works in higher frequency without any thermal safety violation while its temperature is close to critical thermal(More)
This article presents a simple and effective approach of high performance microprocessor's throughput enhancement. It aims at introducing of the notion of Reaction Time (RT). RT is a value that describes the time in which the TΔT control system is fed about the change in ambient cooling condition. Utilization of an additional temperature sensor(More)
The paper describes UMC CMOS 0.18 μm (1.8 V) implementation of OctaLynx D microcontroller. The processor is 8-bit RISC structure with built-in Dynamic Thermal Management Unit cooperating with Temperature-Controlled Oscillator. The Dynamic Thermal Management Unit consists of clock source multiplexer, thermal interrupts control unit and special(More)
The aim of this paper is energy dissipation analysis in regards to supply voltage and temperature. The basis of all simulations are 12 different transistors coming from 6 different CMOS technologies (from 180nm to 14nm). Dynamic energy used to switch a gate from one state to the other was evaluated in a range of temperature for different supply voltages. In(More)
The article presents a quasi-optimum placement of different functional modules in an integrated circuit. The goal of quasi-optimum placement is minimization of maximum chip temperature. Firstly, a RC thermal model of the microprocessor packages is presented. Based on package's geometry and chip lloor topography the HotSpot calculates different parameters(More)
This paper presents a new method of controlling processor power throughput based on information on changing cooling conditions. To find out about cooling conditions additional sensor is required. It is mounted on edge of a heatsink. Firstly, a RC thermal model of system IC - heatsink is presented. Parameters for this model were found by using numerical(More)
  • 1