Petro Komakha

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This paper reports on the design of a very compact dual-band highly-integrated front-end module for size-critical wireless applications supporting IEEE 802.11a/b/g standards. The module consists of two novel high-rejection lumped-element diplexers which are connected to one common antenna via single-pole-double-through (SPDT) switch. The novelty of the(More)
A very small form factor and low profile quad-band System-in-Package (SiP) module based on the state-of-the-art brand new 65nm CMOS IC is presented. The SiP module provides full function of 2.4G and 5G WLAN, Bluetooth, GPS, FM radio and FM transmitter. The highly integrated device incorporates single chip, RF front-end module, filters for dual band WLAN and(More)
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