Per-Erik Tegehall

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In order to place sensors or electronics in very high temperature environments, new materials and methods for interconnection are required. A comparative study between different electrical interconnection methods for very high operation temperatures (500 °C – 800 °C) is presented. Thermo-mechanical simulations and characterization of(More)
The microstructure of lead-free solder joints often consists of only one or a few randomly oriented tin grains as a result of a large degree of undercooling during solidification. Due to the severe anisotropy of single crystal Sn and the random nature of the microstructure, the stress state and microstructural evolution of each joint will be unique.
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