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As processor core counts increase, networks-on-chip (NoCs) are becoming an increasingly popular interconnec-tion fabric due to their ability to supply high bandwidth. However, NoCs need to deliver this high bandwidth at low latencies, while keeping within a tight power envelope. In this paper, we present a novel NoC with hybrid interconnect that leverages(More)
A 4Gb/s serial link tracking clock and data recovery (CDR) circuit fabricated in 0.24µm CMOS technology dissipates 84mW and occupies 0.3mm 2. The input signal is 2× oversampled by 8 offset-cancelled receive amplifiers per receive clock cycle. The samples are processed by a phase controller to position the receive clocks at the center and the edge of the(More)
Biomedical signals exhibit substantial variance in their sparsity, preventing conventional a-priori open-loop setting of the compressed sensing (CS) compression factor. In this work, we propose, analyze, and experimentally verify a rate-adaptive compressed-sensing system where the compression factor is modified automatically, based upon the sparsity of the(More)
(250‐word limit) The rapid scaling of microprocessors has shifted the critical bottleneck of high‐performance computing systems from the computational units to the communication infrastructure. By taking advantage of the parallelism and capacity of dense wavelength‐division‐multiplexed (DWDM) technology, optical interconnects using nanophotonics offer a(More)
Silicon photonic links based on ring-resonator devices provide a unique opportunity to deliver distance-independent connectivity, whose pin-bandwidth scales with the degree of wavelength-division multiplexing. However, reliability and robustness are major challenges to widespread adoption of ring-based silicon photonics. In this work, a CMOS photonic(More)
ŠNEXT-GENERATION COMPUTING systems, from high-performance server farms to battery-constrained mobile devices, consist of several microchips on a single PCB substrate. Although current CMOS scaling allows the future integration of several heterogeneous chips on a single die, future computing platforms will also contain many specialized chips from several(More)