Panayotis C. Andricacos

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Copper plating baths used for forming integrated circuit interconnects typically contain three or four component additive mixtures which facilitate the superfilling of via holes and trench lines during damascene plating. Extensive study over the last two decades has provided researchers with an understanding of the underlying mechanisms. The role of cuprous(More)
Studies of the electropolishing of copper are reviewed. Recent work intended to demonstrate the electrochemical planarization of the overburden in electroplated copper interconnect metallization is emphasized. Furthermore, two common reaction mechanisms invoked to explain the mass-transfer limitation required to achieve electropolishing are outlined and(More)
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