P. J. Audrey Swee

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Rapid change of technologies, coupled with increase in demand of quality and reliability, development speed is the top challenge to have market win for semiconductor industries. As semiconductor is moving towards copper wire bonding, failure associated with reliability is critical. While reliability results take time to wait for the cycles to complete in(More)
The increase of gold price had pushed industrial to develop copper wire in order to stay competitive. However, copper is not precious material like gold, there are numerous challenges in bonding & reliability risk associated with stringent automotive reliability requirements. Corrosion associated with copper wire bonding is considered one of the hard to(More)
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