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With the RoHS deadline approaching by July 1, 2006, many manufacturers are aggressively eliminating the use of lead in consumer electronic products. However, the development of lead-free products requires close cooperation between end-product manufacturers and component manufacturers because metallurgies, resin materials, reflows conditions and moisture(More)
The tapered fiber microlens (TFM) enhances efficient coupling between the elliptical Gaussian pattern laser diode and single-mode fiber. The hyperbolic-end microlens has much higher coupling efficiency than the hemispherical-end microlen due to efficient mode matching and phase matching.
In the study, one 14x14 lead free CSP BGA with 0.3 mm/0.5 mm ball diameter/pitch was adopted as test vehicle. The intermetallic compounds morphology evolution which can be generated when using SnxAgCu and SnAgCuX solder ball in combination with electrolytic NiAu-plated substrates was investigated during 150degC thermal aging, such as single layer SnNi IMC(More)
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