Owen Sullivan

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Super-lattice thin-film thermoelectric coolers (TEC) are emerging as a promising technology for hot spot mitigation in microprocessors. This paper studies the prospect of on-demand cooling with advanced TECs integrated at the back of the heat spreader inside a package (integrated TEC). The thermal compact models of the chip and package with integrated TECs(More)
Site-specific on-demand cooling of hot spots in microprocessors can reduce peak temperature and achieve a more uniform thermal profile on chip, thereby improve chip performance and increase the processor's life time. An array of thermoelectric coolers (TECs) integrated inside an electronic package has the potential to provide such efficient cooling of hot(More)
— Superlattice thin-film thermoelectric coolers (TECs) are emerging as a promising technology for hot spot mitigation in microprocessors. This paper studies the prospect of on-demand cooling with advanced TECs integrated at the back of the heat spreader inside a package (integrated TEC). Using thermal compact models of the chip and package with integrated(More)
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