Osamu Nukaga

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An epoch-making glass interposer having high-density three-dimensional structured through glass via (TGV) was proposed and demonstrated. By using femtosecond laser-assisted etching and plating, TGVs including bent (crank-shaped) portions were successfully fabricated inside single silica substrate. The diameter of the TGV was 15 μm and the length was 2 mm,(More)
We demonstrate a lateral patch-cramp device structure, made of fused silica, whose patch pipettes were fabricated by using femtosecond laser irradiation and wet etching. The pipettes were an oval-shaped cross-section that was 200 nm × 4 μm, and the minor axis can be controlled on the nano-scale. It is expected that a Giga-seal resistance and its observation(More)
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