Osamu Horiuchi

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The stress of integrated circuits caused by flip-chip bonding (FCB) is evaluated using piezo-sensor embedded test element group (TEG) chips. After non-conductive film (NCF) coating, the TEG chips are(More)
We demonstrate the concept and fabrication of through cavity core device-embedded substrate (DES) for fine-pitch Si bare chips with pad pitches up to 60 μm. In order to investigate the fabrication(More)