Olivier Daniel

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The recent PWB embedding technology is an attractive packaging alternative that allows a very high degree of miniaturization by stacking multiple core layers of embedded chips, using copper filled micro-vias as interconnections to improve electrical performances. The adoption of disruptive technology in future PWB designs will further increase the thermal(More)
Latest Computational Fluid Dynamic tools allow modelling more finely the conjugate thermo-fluidic behaviour of a single electronic component mounted on a Printed Wiring Board. A realistic three-dimensional representation of a large set of electric copper traces of its composite structure is henceforth achievable. So it is possible to confront the(More)
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