Olaf van der Sluis

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Due to the miniaturization of integrated circuits, their thermo-mechanical reliability tends to become a truly critical design criterion. Especially the introduction of copper and low-k dielectric materials cause some reliability problems. Numerical simulation tools can assist developers to meet this challenge. This paper considers the first bond integrity(More)
For the development of state-of-the-art Cu/low-k CMOS technologies, the integration and introduction of new low-k materials are one of the major bottlenecks due to the bad thermal and mechanical integrity of these materials and the inherited weak interfacial adhesion. Especially the forces resulting from packaging related processes such as dicing, wire(More)
In this paper, a fast moisture sensitivity level (MSL) qualification method and a fast moisture characterization method are discussed. The fast moisture characterization uses a stepwise method to obtain more reliable and more material moisture properties. The established relationships for moisture diffusion coefficients and moisture saturation levels with(More)