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  • Sridhar Ramaswamy, Nithin Yathapu, Gerhard Lembach, Michael Guse, M. I. Linnane
  • Engineering
  • IEEE/SEMI Advanced Semiconductor Manufacturing…
  • 2010 (First Published: 1 July 2010)
  • This paper presents a methodology that uses unpatterned wafer inspection to detect material-related micro-masking defects in a tri-layer stack. We investigated two approaches to detect the source ofContinue Reading
  • Nithin Yathapu, Steve McGarvey, Justin Brown, Alexander Zhivotovsky
  • Physics, Engineering
  • SPIE Advanced Lithography
  • 2016 (First Published: 25 March 2016)
  • This study explores the feasibility of Automated Defect Classification (ADC) with a Surface Scanning Inspection System (SSIS). The defect classification was based upon scattering sensitivity sizingContinue Reading