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Deformation and bonding processes in aluminum ultrasonic wire wedge bonding
The ultrasonic wire bonding (UWB) process has been examined using transmission electron microscopy (TEM) and standard wire pull testing techniques. Al-0.5 wt.% Mg wires 75 μm in diameter were bondedExpand
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A microstructural study of dislocation substructures formed in metal foil substrates during ultrasonic wire bonding
A study has been conducted on the deformation mechanisms in metal substrates subject to aluminum ultrasonic wire bonding (UWB). Aluminum wires were bonded to copper, nickel, stainless steel, andExpand
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A transmission electron microscopy study of defect generation and microstructure development in ultrasonic wire bonding
Ultrasonic wire bonding is widely used in the electronic industry to connect semiconductor chips to packages. Even though the popularity of the technique has increased in recent times, questionsExpand