Nihal Sinnadurai

  • Citations Per Year
Learn More
Conclusions Plastic encapsulation is now a high reliability (HiRel) method of packaging active semiconductor devices and microelectronics in general. In this new work, tropical climates have been analyzed and shown to be appreciably more severe than those safeguarded by current hermeticity and accelerated test standards in Mil-Std-883, "Test Methods &(More)
  • 1