Nemanja Vokic

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High speed and low power transmission on optical interconnections can be achieved using ring-based optical modulators. 3D-integration of the ring modulator on top of the driver chip allows compact and cheap transmitters. 4-PAM modulation is considered for the first time for a high data rate.This paper presents a 10 Gb/s ring modulator driver with high and(More)
This paper presents ring modulator driver and receiver circuits designed for three-dimensional photonic-electronic integration using interwafer connections, whose parasitic capacitance is expected to be in the order of 15 fF. Both transmitter and receiver can operate with binary and PAM-4 modulation at 10 Gb/s. To the authors knowledge, it is the first(More)
Developing paradigm in high speed communication device is heterogeneous 3D integration of electronic components - designed on standard silicon wafers - and photonics, optimized in different processes. This paper shows the advantages of 3D integration and presents the measured results of two receivers fabricated in 0.35 μm SiGe BiCMOS technology. The(More)
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