Naokazu Murata

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— Effect of the change of crystallinity and micro texture of electroplated copper thin films by annealing on the stress-induced migration was investigated experimentally and theoretically. The micro texture of electroplated copper thin films changed drastically as a function of their electroplating conditions and the annealing temperature after the(More)
Effect of the micro texture of electroplated copper thin film interconnections on stress-induced migration was investigated experimentally and theoretically. The micro texture of electroplated copper thin films changed drastically as a function of the annealing temperature after the electroplating. However, stress-induced migration was activated even though(More)
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