N. Suwannata

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In the process of HGA fabrication, a shunting process is performed in order to prevent the ESD effect but when an HGA is required for another process the shunt tab has to be trimmed. This process is thought to cause the damage of GMR heads at the Al<sub>2</sub>O<sub>3</sub> gap between the shunt tab and the substrate. The simulated and measured results are(More)
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