N. Nenadovic

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In this paper an application of an integral analysis technique is demonstrated for determining Signal Integrity (SI) and Power Integrity (PI) of complex and advanced package solutions. A representative System-in-Package (SiP) product has been selected as a carrier for our study, which is focused on analysis methodology, tools and flow. In particular,(More)
Electrothermal consequences of implementing bulk-silicon RF power MOS processes in the silicon-on-glass sub-strate transfer technology are investigated in this paper. Fabricated silicon-on-glass vertical double-diffused MOSFETs are measured on-wafer and very large thermal resistance values are extracted for each design. The influence of the thermal(More)
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