Myung Jin Yim

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We have investigated the electrical properties of anisotropic conductive adhesive (ACA) joint using submicrometer-sized (~500 nm in diameter) silver (Ag) particle as conductive filler with the effect(More)
In this paper, we investigated the degradation mechanism and the reliability behaviors of flip chip joint using anisotropic conductive adhesives (ACAs) and Au bumped chip under high current density.(More)