Mustafa Ozkok

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  • Mustafa Ozkok
  • 2012 7th International Microsystems, Packaging…
  • 2012
The direct deposition of palladium on copper is not a new surface finish process. Palladium was first introduced to the market as a surface finish on copper by Atotech more than 10 years ago. At that time, it was primarily used as a surface finish for soldering. In addition, it was employed as a contact surface in applications like touch key pads.
The QFN package is one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. The standard QFN Package soldered on a PCB is shown on fig. 1 a). The side edges of th. QFN are not covered by solder, which results in the fact that the package is soldered only planar in: dimensions from the QFN bottom side onto the PCB(More)
OBJECTIVES The University of Iowa Child Protection Program collaborated with Turkish professionals to develop a training program on child abuse and neglect during 2002-2006 with the goals of increasing professional awareness and number of multidisciplinary teams (MDT), regional collaborations, and assessed cases. This paper summarizes the 5-year outcome. (More)
During the past two years, fine pitch copper wire bonding has finally entered high volume production. It is estimated that nearly 15% of all wire bonders used in production are now equipped for copper wire bonding. Most of these are used exclusively for copper wire bonding. In terms of pitch, copper wire is only barely lagging behind the most advanced gold(More)
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