Muhamad Hafiz Ab Aziz

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Wire bonding method are utilized to facilitate the interconnection in the demanding development of integrated circuits. Wire bond shear test method is utilized in the industry to scrutinize the quality of the wire bond. This paper discusses about the simulation of wire bond shear test using aluminium wire. This study is focused on evaluating the effects of(More)
Tremendous effort is put into enhancing reliability of Ball grid array (BGA) solder joints. The BGAs are utilized as interconnection method in the electronic packaging industry due to its vast advancement in circuit miniaturization. New materials are introduced to further improve the reliability of the BGA solder joint. In this study, the stress response of(More)
Shear height has substantial effect on the solder ball shear strength. In recent times, taking environmental issue into consideration, Lead free solder joint must be developed. In this paper, the load effect of different shear heights with fixed shear speed of a single solder joint on Ball Grid Array (BGA) is presented through simulation. A Lead free(More)
Printed circuit board (PCB), assembly process is developing in a rapid pace. These PCBs are utilized in a heavily in the electronic manufacturing industry. During assembly process, the PCB plates are subjected to mechanical loads such as bending which induces stress distribution on the PCB plates. In this paper, a study on the printed circuit board (PCB)(More)
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