Moyra K. McManus

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Backside light emission and electrical measurements were used to evaluate the susceptibility to latchup of externally cabled I/O pins for a 0.13 µm technology generation [1,2] test chip, which was designed in a flip-chip package. Case studies of several Inputs/Outputs (I/Os) are shown along with conclusions regarding layout and floorplanning to ensure the(More)
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