Moustafa Mohamed

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While transistor performance and energy efficiency have dramatically improved in recent years, electrical interconnect improvements has failed to keep pace. Recent advances in nanophotonic fabrication have made on-chip optics an attractive alternative. However, system integration challenges remain. In particular, the parameters of on-chip nanophotonic(More)
On-chip communication, including short, often-multicast, latency-critical coherence and synchronization messages, and long, unicast, throughput-sensitive data transfers, limits the power efficiency and performance scalability of many-core chip-multiprocessor systems. This article analyzes on-chip communication challenges and studies the characteristics of(More)
The nanophotonic network promises improved communications between cores in many-core systems. This paper discusses a novel modeling and simulation methodology. This infrastructure can compare performance, power consumption and reliability of nanophotonic network designs. Phenomenologically determined transfer-matrix device models are employed to(More)
Intercore communication in many-core processors presently faces scalability issues similar to those that plagued intracity telecommunications in the 1960s. Optical communication promises to address these challenges now, as then, by providing low latency, high bandwidth, and low power communication. Silicon photonic devices presently are vulnerable to(More)
Recent advances in nanophotonic technology have made nano- photonic interconnect an attractive on-chip communication solution for emerging many-core systems. However, fabrication- induced process variation and run-time system thermal effects directly affect nanophotonic device operation, and introduce serious challenges, e.g., signal power loss and(More)
To evaluate the role of ultrasonic waves in enhancing the effect of 5-fluorouracil (5-FU) as anticancer drug, tumor growth, cell ultrastructure and temperature rises of ascites Ehrlich tumor implanted in mice were investigated at a frequency of 0.8 MHz. Different conditions of ultrasonic intensity (1, 2 and 3 W/cm(2)), sonocation time (1, 3 and 5 min) and(More)
An array of passive silicon-on-insulator optical devices is laid out in repeating patterns on four foundry-fabricated wafers. The physical and optical characterization of these microrings, racetrack resonators, and directional couplers are found to exhibit significant variation in optical response. A device-heating experiment carried out on a number of(More)
Recent advances in silicon photonic device and fabrication technologies make silicon photonic interconnect a promising communication fabric to address the inter-core and inter-die interconnect challenges for future embedded many-core processors. Informed design decisions in silicon photonic interconnection require optimization of performance, power(More)