Mohd Z. Abdullah

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Keywords: Integrated circuit (IC) encapsulation Fluid structure interaction (FSI) Response surface methodology (RSM) Central composite design (CCD) a b s t r a c t Optimized design of the integrated circuit (IC) package gives better IC encapsulation process and minimizes the stress concentration and deformation of the IC structures. The physical and process(More)
In most cases authors are permitted to post their version of the article (e.g. in Word or Tex form) to their personal website or institutional repository. Authors requiring further information regarding Elsevier's archiving and manuscript policies are encouraged to visit: a b s t r a c t This paper presents a fluid–structure interaction (FSI) analysis of(More)
The current paper introduces an effective numerical technique for optimization of the cooling stage of reflow soldering process. The study aims to optimize the thermal stress of a solder joint and cooling rate of a ball grid array package using the gray-based Taguchi method. The current methodology comprised numerical techniques for computational fluid(More)
Keywords: IC encapsulation Integrated circuits (IC) Computer-aided simulation Fluid–structure interaction (FSI) a b s t r a c t The rapid development of computing software has facilitated multifarious research in integrated circuit (IC) packaging. Complicated and complex processes can be visualized via simulation modeling with this software. The(More)