Mohd. Rafie Johan

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This paper investigates the growth of intermetallics in Sn-3.8Ag-0.7Cu (SAC) solder with and without Co nanoparticle reinforcement. Co reinforced composite was prepared by mechanically mixing 0.5 wt% and 1.5 wt% Co nanoparticles respectively into Sn-3.8Ag-0.7Cu solder paste. The formation and growth of the intermetallic compounds (IMC) at the solder joint(More)
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