Mohd F. Abdulhamid

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Electromigration (EM) and thermomigration (TM) are processes of mass transport which are critical reliability issue for next generation nanoelectronics. The purpose of this project is to study influence of low temperature on EM and TM interaction. In this paper, a model for EM and TM process is proposed and has been implemented in finite element method. The(More)
Electromigration (EM) and thermomigration (TM) are processes of mass transport which are critical reliability issues for next generation nanoelectronics and power electronics. The purpose of this project is to develop a computational tool for simulating damage mechanics of EM and TM and their interaction. In this paper, a model for EM and TM processes is(More)
Thermomigration experiments were conducted to study the change in mechanical properties of 95.5Sn–4Ag–0.5Cu (SAC405) lead-free solder joint under high temperature gradients. This paper presents some observations on samples that were subjected to 1000°C /cm thermal gradient (TG) for 286 h, 712 h, and 1156 h. It was observed that samples subjected to thermal(More)
Competing mechanisms of electromigration and thermomigration in flip chip SnAgCu (SAC) solder joints was studied experimentally. A chain of solder joints were stressed at 2.0 × 10 Amps/cm, 2.4 × 10 Amps/cm, and 2.8 × 10 Amps/cm current density at room temperature. In the test vehicle, some solder joints were exposed to a combination of electromigration and(More)
High current density and high temperature gradient are major reliability concern for next generation nanoelectronic packaging and power electronics. High current density experiments on lead free solder joints coated with NiAu and non-coated Cu pads were conducted at 20, 30, 40 and 50 C ambient temperatures. The time to failure (TTF) shows that solder joints(More)
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