Moganraj Palianysamy

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Interconnection technology has improved by leaps and bounds since the advent of solder reflow. This has made surface mount technology more robust. Ball Grid Array (BGA) is a demanding surface mount chip package in Integrated Circuits (IC) which uses a grid of solder balls as its connectors. In this preliminary study, load effects of shear test on a single(More)
Reactive Ion Etching (RIE) is a major process in the fabrication of semiconductor devices for transferring patterns from masks to semiconductor substrates. Design Of Experiment(DOE) has been used to study the effect of Reactive Ion Etch(RIE) towards surface morphology of aluminum bond pad. Important RIE factors involved in this experimental study are ratio(More)
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