Min-Hyeong Kim

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Three kinds of Bi-based solder powders with different chemical compositions of binary Bi–Sn, ternary Bi–Sn–In, and quaternary Bi–Sn–In–Ga were prepared using a gas atomization process and subsequently ball-milled for smaller-size fabrication. In particular, only the quaternary Bi–Sn–In–Ga solder powders were severely broken to the size of less than 10 µm in(More)
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