Mike Chou

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Industry trends aimed at integrating higher levels of circuit functionality have triggered a proliferation of mixed analog-digital systems. Magnified noise coupling through the common chip substrate has made the design and verification of such systems an increasingly difficult task. In this paper we present a fast eigendecomposition technique that(More)
Accurate modeling of noise coupling effects due to crosstalk via the substrate is an increasingly important concern for the design and verification of mixed analog-digital systems. In this paper we present a technique to accelerate the model computation using BEM methods that can be used for accurate and efficient extraction of substrate coupling parameters(More)
The extraction of substrate coupling resistances can be formulated as a first-kind integral equation, which requires only discretization of the two-dimensional contacts. However, the result is a dense matrix problem which is too expensive to store or to factor directly. Instead, we present a novel, multigrid iterative method which converges more rapidly(More)
Industry trends aimed at integrating higher levels of circuit func-tionality have triggered a proliferation of mixed analog-digital systems. Magnified noise coupling through the common chip substrate has made the design and verification of such systems an increasingly difficult task. In this paper we present a new method based on a precorrected-DCT(More)
Industry trends aimed at integrating higher levels of circuit functionality have triggered a proliferation of mixed analog-digital systems. Magniied noise coupling through the common chip substrate has made the design and veriication of such systems an increasingly diicult task. In this paper we present a fast eigendecomposition technique that accelerates(More)
Abstract: Multipole-accelerated surface-volume methods have proved to be very efficient techniques for delay and cross-talk simulation of three-dimensional integrated circuit interconnect. However, to be efficiently combined with transistor circuitry in a SPICE-level simulation, reduced-order models which have accurate low-frequency behavior must be(More)
— Accurately accounting for three-dimensional (3-D) geometry and distributed RC effects in on-chip interconnect is important for predicting crosstalk in memory cells, analog circuits, and regions of congested routing in digital circuits. In this paper we describe a multipole-accelerated, mixed surface-volume formulation, and a preconditioned model-order(More)
It has recently been shown that the boundary-element method can be used to perform accurate cross-talk simulations of three-dimensional integrated circuit interconnect. However, the computational complexity grows as N2, where N is the number of surface unknowns. Straightforward application of the fast-multipole algorithm reduces the computational complexity(More)
The Submicron Structures Laboratory at MIT develops techniques for fabricating surface structures with feature sizes in the range from nano-meters to micrometers and uses these structures in a variety of research projects. These projects, described briefly below, fall into four major categories: (1) development of submicron and nanometer fabrication(More)
In this paper, a formula is derived which relates the electrostatic geometric sensitivity of the potential generated by a triangular panel charged with uniform source distribution to the potential of a linear dipole distribution on the panel. Closed form analytic formula for the potential generated by this linear dipole distribution is also derived for fast(More)