T he flagship publication of the MTT-S is IEEE Transactions on Microwave Theory and Techniques. As the premier journal in the microwave field, we seek to capture and disseminate knowledge of RF, microwave, guided-wave, and wireless technologies. We provide a service to many of our members who want to publish their contributions, and we provide a service to… (More)
— Compact electrothermal modeling of lumped electrical devices and compact thermal modeling of volu-metric materials enables efficient electrothermal modeling of microwave circuits. The compact thermal model of the body of an X-band MMIC is based is based on analytical solutions of the heat diffusion equation in thermal sub-volumes. The model is… (More)
3D-ICs promise to reduce wire-delays, but non-idealities threaten to diminish the benefit. This paper presents an analysis of the performance improvement of a standard-cell implementation of an FFT when designed for the three-tier process from MIT Lincoln Labs. The methodology is presented, along with analyses of delay, routing congestion, and heat. The… (More)
Heterogeneous wafer-scale circuit architectures" (2007).
B eyond 3G is the official IEEE designation for the next stage of wireless technology that some people call 4G or fourth-generation radio. Over the years, every conceptual shift in wireless technology has been characterized as a generational change. With a good dose of hindsight, the generations of radio and major radio systems in each category are… (More)