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The solder joint reliability of ceramic chip resistors assembled to laminate substrates has been a long time concern for systems exposed to harsh environments such as those found in automotive and aerospace applications. This is due to a combination of the extreme temperature excursions experienced by the assemblies along with the large coefficient of(More)
The solder joint reliability of ceramic chip resistors assembled to laminate substrates has been a long time concern for systems exposed to hush environments such as those found in automotive and aerospace applications. This is due to a combination of the extreme t e m p e r a m excursions experienced by the assemblies along with the large coefficient of(More)
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that the observed material behavior variations of SnAg -Cu (SAC) lead free solders during room(More)
Metal Chalcogenides (MCs) have emerged as an extremely important class of nanomaterials with applications ranging from lubrication to energy storage devices. Here we report our discovery of a universal, ultrafast (60 seconds), energy-efficient, and facile technique of synthesizing MC nanoparticles and nanostructures, using microwave-assisted heating. A(More)
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