Melvin Galicia

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In modern integrated circuits, manufactured in nanometer technologies, reducing the hotspot temperature even by several degrees may lead to significant advantages. In particular, in high performance processors, lower temperature translates into fewer reliability concerns, lower cooling costs, the possibility of increasing the operating frequency and(More)
Integrated liquid cooling is a promising idea for future 3D integrated circuits and potentially a scalable solution for ever-increasing power dissipation. In this paper, we analyze the efficiency of heat removal from a 3D stacked chip with microchannels. We build a detailed chip model and perform a coupled thermo-fluidic finite element method simulation for(More)
A variety of thermal models has been proposed to predict the temperatures inside modern processors. In this paper, we describe and compare two such approaches, a detailed FEM-based simulation and a simpler architectural compact model. It is shown that both models provide comparable results when it comes to predicting the maximal temperature, however there(More)
3D stacking of integrated circuits is a promising idea for increasing the processor performance. However, the major challenge is overcoming thermal issues due to excessive power density. In this paper, using Intel's Haswell processor as an example, we analyze the thermal behavior of an eight-core processor implemented as a 2D chip and as a 3D architecture(More)
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