Melvin Galicia

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3D stacking of integrated circuits is a promising idea for increasing the processor performance. However, the major challenge is overcoming thermal issues due to excessive power density. In this paper, using Intel's Haswell processor as an example, we analyze the thermal behavior of an eight-core processor implemented as a 2D chip and as a 3D architecture(More)
A variety of thermal models has been proposed to predict the temperatures inside modern processors. In this paper, we describe and compare two such approaches, a detailed FEM-based simulation and a simpler architectural compact model. It is shown that both models provide comparable results when it comes to predicting the maximal temperature, however there(More)
Integrated liquid cooling is a promising idea for future 3D integrated circuits and potentially a scalable solution for ever-increasing power dissipation. In this paper, we analyze the efficiency of heat removal from a 3D stacked chip with microchannels. We build a detailed chip model and perform a coupled thermo-fluidic finite element method simulation for(More)
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