Max O. Bloomfield

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We summarize two approaches to integrated multiscale process simulation (IMPS), particularly relevant to integrated circuit (IC) fabrication, in which models for equipment (m) and feature (lm) scales are solved simultaneously. The first approach uses regular grids, and is applied to low-pressure chemical vapor deposition (LPCVD) of silicon dioxide from(More)
Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate(More)
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