Max O. Bloomfield

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Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate(More)
Formation and evolution of microstructure in thin films, numerical approaches to modeling of multiscale/multiphysics phenomena. Specific interests include methods for linking macro-and meso-scale simulations to nano-scale evolution models, models of electrochemical and electroless deposition in complex solutions, discrete-to-continuum techniques, and(More)
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