Masanobu Yoshimi

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Substrate engineering using Smart Cut<sup>TM</sup> and Smart Stacking<sup>TM</sup> for advanced LSIs is overviewed. For digital CMOS applications, planar fully-depleted (FD) SOI structure provides a realistic solution to bridge the technology gap between bulk CMOS and three-dimensional FD structures. Production of planar FD-SOI will be started soon in 28nm(More)
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